Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey ITT

{
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    "name": "University of Strathclyde"
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  "date": "2025-05-20T00:00:00Z",
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    "description": "The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semiconductor packaging line.\r\n The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS). The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in an ISO-7 (class 10,000) clean room environment. The equipment within the facility will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. As part of this project, NMIS has a requirement to procure a turnkey capability in wafer thinning, polishing, cleaning - which includes water management ancillary systems.\r\n High-efficiency grinder/polisher for wafers\r\n A Deionised Water Recycling Unit\r\n Automatic Cleaning System for wafers",
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        "description": "The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semiconductor packaging line.\r\n The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS). The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in an ISO-7 (class 10,000) clean room environment. The equipment within the facility will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. As part of this project, NMIS has a requirement to procure a turnkey capability in wafer thinning, polishing, cleaning - which includes water management ancillary systems.\r\n High-efficiency grinder/polisher for wafers\r\n A Deionised Water Recycling Unit\r\n Automatic Cleaning System for wafers",
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        "id": "MAY530711",
        "title": "Supply, Delivery, Installation \u0026 Commissioning of a Wafer Thinning Turnkey ITT",
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        "description": "The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semiconductor packaging line.\r\n The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS). The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in an ISO-7 (class 10,000) clean room environment. The equipment within the facility will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. As part of this project, NMIS has a requirement to procure a turnkey capability in wafer thinning, polishing, cleaning - which includes water management ancillary systems.",
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    "reviewDetails": "Precise information on deadline(s) for review procedures:\r\n An economic operator that suffers, or risks suffering, loss or damage attributable to a breach of duty under the Public Contracts (Scotland) Regulations\r\n 2015(SSI2015/446) (as amended) may bring proceedings in the Sheriff Court or the Court of Session.",
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          "minimum": "4B.5.1- 4B5.3 Insurances\r\n Insurance requirements are in line with levels identified in the UOS standard Terms and Conditions.\r\n It is a requirement of this contract that bidders can hold or commit to obtain prior to the commencement of any subsequently awarded contract, the types of insurance indicated below:\r\n The Contractor shall maintain in force with reputable insurers\r\n Employer\u00e2\u0080\u0099s (Compulsory) Liability Insurance = GBP 10m\r\n Public and Product Liability Insurance = GBP 10m\r\n Professional Risk Indemnity Insurance = GBP 2m\r\n In respect of any one incident and unlimited as to numbers of claims",
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    "title": "Supply, Delivery, Installation \u0026 Commissioning of a Wafer Thinning Turnkey ITT",
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