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Supply, Delivery and Installation of Sinter Bonding Capability

University of Strathclyde

Buyer Contact Info

Buyer Name: University of Strathclyde

Buyer Address: Learning & Teaching Building, 49 Richmond Street, Glasgow, UKM82, G1 1XU

Contact Name: Anna Sanina

Contact Email: anna.sanina@strath.ac.uk

Contact Telephone: +44 7811592949

Status
active
Procedure
open
Value
900000.0 GBP
Published
17 Dec 2025, 00:00
Deadline
26 Jan 2026, 12:00
Contract Start
n/a
Contract End
n/a
Category
goods
CPV
38000000
Region
n/a
Awarded To
n/a
Official Source
Open Public Contracts Scotland

Description

National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages.

Linked Documents

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No linked documents found for this notice.

Opportunity Context

More Information Links

External Link: https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=DEC545904

Link Title: Supply, Delivery and Installation of Sinter Bonding Capability

Link Description: National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages.

Lots

Lot Description: NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is able to support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, dice/cut, bond, interconnect, package and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The focus of this procurement activity is to acquire a sinter bonding press that is versatile to support both R&D activities and medium volume production. In the R&D context we require a capability that allows flexible exploration of tooling to achieve different package arrangements, while keeping tool costs at a minimum. In the medium scale production context we require a capability that includes automated handling solutions such that it can be fed by a magazine unstacker, and can feed a magazine stacker. In either context we require the ability to form bonds under inert atmosphere or forming gas, control the pre-heating and post-cooling ramp profile of sinter bonded assemblies and collect detailed sensor-driven time-histories of temperature and pressure for each bonding operation.

Lot 1 Status: active

Lot 1 Has Options: Yes

Lot 1 Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Lot 1 Award Criterion (quality): Quality

Documents

Document Title: Supply, Delivery and Installation of Sinter Bonding Capability

Document Description: National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages.

Raw Notice JSON

Expand raw payload
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